With a heating zone length of 1850 mm or 2350 mm the convection reflow soldering systems GoReflow 1.8 and GoReflow 2.3 are ideally suited for small to medium-sized production series. The machines are not only featured with an outstanding attractive design, above all the systems convince with their well-engineered concept and excellent soldering results.

5 respectively 7 heating zones provide maximum flexibility in temperature profiling, particularly for the lead-free soldering process.

The GoReflow systems are designed for soldering in ambient atmosphere. A high volume of circulated process gas, which is generated with axial fans, and especially adapted slot nozzles ensure a very homogeneous heat distribution over the complete transport width at simultaneously moderate gas velocities. Thus, a very good heat transfer rate is realized so that the set temperatures of the oven can remain on a lower level. This helps a lot to fulfill today's requirements concerning the narrow process window of the lead-free soldering process: all the components will be soldered whereas the temperature impact on the components is reduced significantly.

A flux management system with stainless steel filter is integrated in the peak and cooling area. Flux residues are collected in a PE bottle and therefore easy to dispose.

Depending on the production requirements there is a choice of different conveyor concepts available for the GoReflow systems: a belt conveyor, a pin chain conveyor with or without center board support, or a combination of belt and pin chain conveyor.

Of course, the systems are provided with an up-to-date control unit for easy and quick programming and they may be integrated into a fully automated production line. www.seho.de