Glenbrook Technologies presents the advanced capabilities of its new, more compact JewelBox 90T and 70T real-time x-ray inspection series. Both systems allow users to examine internal solder joints and bonds in advanced technology packages -- BGAs, µBGAs, flip-chips, ICs and other complex components -- that cannot be verified by visual inspection. Both systems also obtain precise images from soft materials -- molded plastics and encapsulants -- as easily as from denser materials.

Images that can be obtained from the two systems allow users to identify solder voids, insufficient reflow or cracks in 1-mil wires quickly and easily in either laboratory or production applications.

All JewelBox systems provide geometric magnification up to 500x and electronic magnification up to 2000x. Five-axis manipulation allows full 360° rotation and 45° tilt. The anode voltage of the JewelBox 90T is 90kV, with a 5 to 7 micron focal spot, and of the JewelBox 70T is 80kV, with a 10 micron focal spot.

Like all Glenbrook systems, the JewelBox series features the company’s patented, award-winning x-ray camera technology that delivers superior image quality with excellent resolution and sensitivity. www.glenbrooktech.com