Dage Precision Industries Ltd. will showcase its newest developments in x-ray inspection and bondtesting technology. 

On display will be the Dage XiDAT XD7600NT digital x-ray inspection system equipped with 250 nanometers feature recognition 2D inspection capability and computerized tomography (CT) providing 3D modeling and volumetric measurement of solder interconnections for critical applications such as stacked die, MEMS, package-in-package and package-on-package.

The XiDAT XD7500VR digital x-ray inspection system with oblique angle viewing and 950 nanometers feature recognition capability will also be displayed.  Both the XD7600NT and XD7500VR are equipped with Dage’s award winning and easy to use ImageWizard software providing world class inspection quality.

In addition, Dage will exhibit its newest developments in bondtesting technology including the 4000HS High-Speed Bondtester and 4000 Multi-Purpose Bondtester.  The award winning 4000HS High-Speed Bondtester is particularly suitable for the detection of brittle fracture failures, a phenomenon that can occur with lead-free materials.

With international headquarters located in the United Kingdom, Dage Precision Industries Ltd. manufactures and supports a complete range of award winning digital x-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.  www.dage-group.com