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• North American Version PDF
- Editorial -
IPC Midwest wins the first round
Trevor Galbraith
- Technology Focus -
Pin-in-hole reflow (PIHR) and lead-free solder joints
David Bernard, Bob Willis
Chip packaging 2.0 – User-definable chip pinout packaging for optimized PCB design
Martin Hart
Package on package (PoP) process development and reliability evaluation
Jonas Sjoberg, David A. Geiger, Todd Castello and Dr. Dongkai Shangguan
- Special Features -
Alex Shimada interview – Panasonic
Productronica preview
Case Study: One company’s lead-free journey
Company Focus: phoenix|x-ray systems
- Regular columns -
Bob Willis’ top ten reference books, plus new lead-free reviews (European edition)
Bob Willis
Managing technological change (North American edition)
Joe Fjelstad
Solid first half but financial concerns prompt caution
Walt Custer and Jon Custer-Topai
System integration services: a new role for the EMS
Carsten Barth
How to estimate solder joint reliability, part 2
Werner Engelmaier
- Other regular features -
Industry News
New Products
Association News
International Diary |
