Global SMT & Packaging magazine - FlipTop™ BGA Socket available for 1.00mm pitch devices

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Flip–Top™ BGA Socket available for 1.00mm pitch devices

Posted by Global SMT & Packaging on 19 May 2006 at 00:00

Advanced Interconnections Corp. recently launched the next generation Flip-Top™ BGA Socket. Designed for development, test and validation of 1.00mm pitch BGA and LGA devices at speeds up to 2.6GHz (single-ended), the compact design requires no soldering of the IC and needs no external hold-downs or tooling holes in the PC board. The new series is available for either thru-hole or surface mount applications. Unique features include solder ball terminals (traditional Sn/Pb or new lead-free Sn/Ag/Cu), an integral finned heat sink or coin screw, and patented spring pin technology that matches the device footprint. www.bgasockets.com

Keywords : Advanced Interconnections, bga socket, bga sockets

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