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- Editorial -

Another odd year, another Productronica!
Trevor Galbraith

- Technology Focus -

Reducing power consumption by selecting optimal oven recipes
Abhinav Ajmera, Sreekanth Varma Penmatsa and Prof. S. Manian Ramkumar

Film vs. paste: Die attach options for stacked die applications
James T. Huneke, Robert Chu, Jin-O Choi, Howard Yun and Han Wu

Embedded thermoelectric cooling
Jesko von Windheim

SnAgCuBi and SnAgCuBiSb solder joint properties investigations
R. Kisiel, K. Bukat K., J. Sitek, W. Gąsior, Z. Moser and J. Pstruś

- Special Features -

Guenter Lauber interview – Siemens Electroincs Assembly Systems
Productronica 2007 – Show Special
Company Focus: SovTest
Technology Focus: Automation of final assembly in the electronics industry

- Regular columns -

Occam update (North American edition)
Joe Fjelstad

Defect Troubleshooter: As good as the information provided (European edition)
Bob Willis

Recovering at a slower pace: Holiday electronics’ purchases are key
Walt Custer and Jon Custer-Topai

How to assure solder joint reliability with accelerated testing
Werner Engelmaier

Manufacturing in Eastern Europe
Carsten Barth