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Solder pastes are key materials in surface mount technology (SMT) for assembly of printed circuit boards (PCBs). Introduction of lead-free has placed new demands on materials and processes in SMT, requiring materials and process engineers to adopt to lead free whilst ensuring process yields stay at the highest possible levels. Key is the solder paste, a material of great complexity involving engineering sciences, metallurgy, chemistry and physics. This article helps those working with solder pastes improve their understanding of this key material.
(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 