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- Editorial -

Africa – dumping ground to the world
Trevor Galbraith

- Technology Focus -

Strength of lead-free bga spheres in high speed loading
Keith Sweatman, Shoichi Suenaga, and Tetsuro Nishimura

Placement optimisation in a lean manufacturing environment
Pierre Chatain

- Special Features -

Global Technology Awards roll of honour
Craig Arcuri interview – NBS Design

- Regular columns -

Why we shrink – The benefits of size reduction in electronics (North American edition)
Joe Fjelstad

Identification of assembly and soldering defects today – history tomorrow (European edition)
Bob Willis

Seasonal winter slowdown has arrived – modest global growth in 2008
Walt Custer and Jon Custer-Topai

- Other regular features -

Industry News
New Products
Association News
International Diary

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