Global SMT & Packaging magazine - 8.2  February 2008

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8.2 – February 2008

Posted by Global SMT & Packaging on 14 February 2008 at 14:11

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Editorial
The APEX effect
Trevor Galbraith

Technology Focus
Full metal TIMs
Robert N. Jarrett, Jordan P. Ross, Ross Berntson

Comparing techniques for temperature-dependent warpage measurement
Jiahui Pan, Ryan Curry, Neil Hubble and Dirk Zwemer

Pin in paste stencil design for notebook mainboard
Atilim Demirtas

Special Features
Stan Renals interview – Cobar

Regular Columns
Practical selection/problems for SMT adhesives
Bob Willis

New finish off to a nice start
Joe Fjelstad

No sugar-coated forecasts, just the facts
Walt Custer and Jon Custer-Topai

Other Regular Features
Industry News
New Products
Association News
International Diary

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2009 Show Preview

Featured Interview

Bryan Gass—Techcon Systems

Bryan talks to Trevor Galbraith about why he believes that implementing a rigid strategy now will strengthen Techcon Systems in these challenging times and beyond.

Small Matters

Synergy, the Occam process and twisted wire interconnect

The term/concept of synergy seems very apt when applied to the interaction of the Occam process solderless assembly concept in combination with a unique PCB interconnection technology called twisted wire interconnect or TWI.

Lead-Free Matters

Measuring package on package-possible procedure, comments welcome

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.