To address the emerging requirements of today’s heat generating devices, Henkel has launched its latest thermal product, PowerstrateXtreme™ Dispensable (PSX–D).  As a paste medium, Henkel’s PSX–D alleviates the challenges associated with phase change films and the shortcomings of thermal greases by incorporating phase change performance into a liquid product, allowing for superior thickness control and considerable manufacturing flexibility.  The material also delivers process adaptability, as PSX–D can be needle dispensed or manually applied onto a heat sink or other surfaces, eliminating the need for additional equipment investment and improving throughput. 

PowerstrateXtreme Dispensable has been optimized as a TIM2 material for use between microprocessors, IGBT, FBDIMM/Memory, GPU, multichip modules, ASICs and their active heat sinks.  The material is also re–workable and repeatable making it especially cost–effective for both lidded and bare die processor applications. www.henkel.com

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