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Nihon Superior USA - Booth 249 PDF Print E-mail

Nihon Superior’s unique SnCuNiGe solder, SN100C®, that has established itself as the best alloy for lead-free wave soldering, will now be available as a high-performance solder paste with a general purpose “P500” flux medium. Because of its high fluidity close to its melting point and fast wetting, SN100C P500 can be used as a drop-in replacement for SAC solder paste in reflow profiles that peak around 240°C. However, it brings to reflow soldering the advantages that have made SN100C such a popular choice in wave soldering, i.e. smooth shiny fillets with no shrinkage defects, high ductility and stable intermetallic with consequent superior performance under vibration, and impact loading. The P500 no-clean halide-free medium delivers excellent printability, long stencil life, good tack, excellent reflow and wetting on all substrates with no solder balls and minimal clear residue. www.nihonsuperior.co.jp

 

Featured Interview

Interview with Ms Michelle Lim, General Manager of Reed Exhibitions

Reed Exhibitions owns 12 NEPCON events in 8 countries ...hear what Michelle has to say!
Ms Michelle Lim, General Manager of Reed Exhibitions

 

Small Matters

Wafer level packaging and the third dimension

Depending on how liberal one is in their definition of what a wafer level package is, the technology is either entering its second, third or perhaps even its fourth or fifth decade of use.

 

Lead-Free Matters

SMART Group launches “Lead-Free Process Defect Guide 2”

With the introduction of lead-free assembly, engineers have experienced a range of new process defects at each stage of manufacture.

 

Global Business

Decent start in 2008—what about the next 18 months?

The first half of 2008 was surprisingly strong for many members of the global electronic food chain.

 

Industry Blogs

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