| Posted by Global SMT & Packaging on 19 February 2008 at 12:06
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 Cobar BV, a member of the Balver Zinn Group, announces the introduction of XF3 lead-free solder paste, developed to accommodate extended reflow profiles without the use of nitrogen. XF3 completes the family of Cobar products based on Nihon Superior’s patented SN100C-alloy.
SN100C has demonstrated superior long-term fatigue strength over silver-containing SAC-alloys. Being completely free of silver, SN100C shines as the only true remedy against Cu-migration into the Sn regions of the solder joint. With XF3, wetting on all common metal surfaces is excellent, yielding shiny joints reminiscent of leaded solders. It exhibits a robust printing window, printing at 150-200mm per second. SN100C-XF3 performs better in eliminating voiding when compared to any SAC-alloy.
The Cobar Group, part of Balver Zinn, can now offer a coherent system of SN100C soldering materials to the customer, ranging from solder bars to cored solder wire, compatible fluxes, and solder paste. Cobar also offers a complete range of SN100C-based Hot Air Leveling products for the board manufacturing industry. www.cobar.com |
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 