Cobar BV, a member of the Balver Zinn Group, announces the introduction of XF3 lead-free solder paste, developed to accommodate extended reflow profiles without the use of nitrogen. XF3 completes the family of Cobar products based on Nihon Superior’s patented SN100C-alloy.

SN100C has demonstrated superior long-term fatigue strength over silver-containing SAC-alloys. Being completely free of silver, SN100C shines as the only true remedy against Cu-migration into the Sn regions of the solder joint. With XF3, wetting on all common metal surfaces is excellent, yielding shiny joints reminiscent of leaded solders. It exhibits a robust printing window, printing at 150-200mm per second. SN100C-XF3 performs better in eliminating voiding when compared to any SAC-alloy.

The Cobar Group, part of Balver Zinn, can now offer a coherent system of SN100C soldering materials to the customer, ranging from solder bars to cored solder wire, compatible fluxes, and solder paste.  Cobar also offers a complete range of SN100C-based Hot Air Leveling products for the board manufacturing industry. www.cobar.com