As rated by the attendees, the Best of Conference Award at the International Wafer–Level Packaging Conference (IWLPC) held in November 2005 was presented to Peter Salmon, SysFlex, Inc (Mountain View, CA).

In his paper, entitled ‘Repairable 3D Semiconductor Subsystem’, Salmon describes a conceptual design for a stacked 3D electronic subsystem that achieves a miniaturization factor of over 100 compared with current assemblies, yet it can be well-tested, repairable, and adequately cooled.

Salmon's paper is featured in the 2005 IWLPC Proceedings available in the SMTA Bookstore and will soon be on-line in the Knowledge Base at smta.org.  The third annual IWLPC has been scheduled for November 2-3, 2006, at the Wyndham Hotel in San Jose, CA.  Visit www.smta.org/iwlpc for more info.

Keywords : IWLPC, semiconductor

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