Metal thermal interface materials (TIMs) offer substantially higher thermal conductivity than other commercially available TIMs. With this high conductivity, these metal TIMs offer the lowest thermal interface resistance, enabling design of higher power and smaller electronic devices. Additionally, the high conductivity translates to less sensitivity to bond line thicknesses and coplanarity issues than polymeric TIMs.

This paper discusses the use of metal thermal interface materials in critical heat flow situations.

Download the full article as a PDF.

This paper originally appeared in the September 2007 issue of Power Systems Design Europe. It was also published in Global SMT & Packaging magazine, issue 8.2, February 2008.

Average user rating

   (0 vote)