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8.3 - March 2008 PDF Print E-mail

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    * European Version PDF
    * North American Version PDF

Editorial
Full of Asian promise
Trevor Galbraith

Technology Focus
Process requirements for high density SMD placement
Sjef van Gastel

Lead free HASL
T. Scimeca, G. Sikorcin, and T. Lentz

Business Focus
Reducing cost in the EMS supply chain through niche sourcing
Dawn Poirier

Special Features
Interview
Nepcon Korea Report
Your guide to APEX 2008
APEX 2008 Technology Showcase

Regular Columns
BGA & stack packages - making dummy parts (European edition)
Bob Willis

A brief history of embedded device technology (North American edition)
Joe Fjelstad

Sobering thoughts for 2008
Walt Custer and Jon Custer-Topai

Other Regular Features
Industry News
New Products
Association News
International Diary