| Posted by Global SMT & Packaging on 12 March 2008 at 09:59
|
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Editorial
Full of Asian promise
Trevor Galbraith
Technology Focus
Process requirements for high density SMD placement
Sjef van Gastel
Lead free HASL
T. Scimeca, G. Sikorcin, and T. Lentz
Business Focus
Reducing cost in the EMS supply chain through niche sourcing
Dawn Poirier
Special Features
Interview
Nepcon Korea Report
Your guide to APEX 2008
APEX 2008 Technology Showcase
Regular Columns
BGA & stack packages - making dummy parts (European edition)
Bob Willis
A brief history of embedded device technology (North American edition)
Joe Fjelstad
Sobering thoughts for 2008
Walt Custer and Jon Custer-Topai
Other Regular Features
Industry News
New Products
Association News
International Diary
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(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 