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Koh Young – Booth 2625 PDF Print E-mail
 

Posted by Global SMT & Packaging on 25 March 2008 at 11:33

3D in-line solder paste inspection is an indispensable tool for process optimisation, improving both overall yield and quality. Koh Young Technology's new product aSPIre 3D in-line solder paste inspection system adds more value to your production. Keeping with high speed SMT lines, aSPIre system helps maximizing productivity and ensures no compromise is made between speed and accurate 100% 3D measurement capability as well as unrivalled measurement performance of <<10% Gage R&R on 01005 deposits.

  • The aSPIre 3D system offers the following:
  • Accuracy: 100% 3D paste measurement is based on patented shadow-free measurement technology.
  • Speed: industry-leading high speed 3D measurement at >40 cm²/sec
  • Intelligence: intelligent user interface allows sers to set up a complete inspection file in just 10 minutes and includes an SPC tool for process optimization
  • Reliability: unrivaled measurement performance of <<10% GR&G on 01005 deposits


www.kohyoung.com

   
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