MV-3L desktop AOI system is the “world’s first” five camera desktop AOI system. Fully configured, the MV-3L provides one top-down camera and four side-view cameras. Each camera provides a native resolution of two megapixels (1600 x 1200). The system’s patented “Quad Angle Lighting System” provides four independently programmable zones for optimal illumination of inspection areas. Two MV-3L systems will be on display during APEX: one will feature a 3-D beam laser system and the other will have an NG marking system.

The MV-3L features a revolutionary Intelli-Beam laser system that provides “the third dimension in inspection capability”—the ability to precisely measure the Z-height of a given region of interest. This advanced technology provides four-point height measurement capability for coplanarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability.

Fully configured, the MV-7L in-line AOI system provides one top-down camera with a native resolution of four megapixels (2,048 x 2,048) and four side-view cameras with a native resolution of two megapixels (1,600 x 1,200). The patented “Quad Angle Lighting System” on the system provides four independently programmable zones for optimal illumination of inspection areas. The MV-7L at APEX will feature a high-throughput, three-stage PCB conveyor and a PCB under board support system.

The revolutionary Intelli-Scan Laser System provides “the third dimension in inspection capability”—the ability to precisely measure the Z-height of a given region of interest. This advanced technology provides: superior lifted lead detection for gull wing devices, four-point height measurement capability for coplanarity testing of BGA and CSP devices, and enhanced solder paste measurement capability.
 
With a maximum inspection area of 26 x 20", the MV-2HTU desktop AOI machine is the ideal AOI solution for manufacturers of extra large printed circuit boards. The MV-2HTU provides one top-down camera with a native resolution of 1.3 mega pixels (1,280 x 960). This award-winning platform is designed to automatically inspect for defects both pre- and post-reflow. These systems offer superior fault coverage for both SMT and through-hole assemblies and will detect defects such as component presence/absence, polarity, misalignment, insufficient solder, excessive solder, solder bridging, bent leads lifted leads solder balls and more.
 
The software for the series is powerful yet simple to use. A comprehensive Package Type Library provides simple “drag and drop” component programming. The Automatic Teaching Tool (ATT) software provides automatic teaching of component locations using CAD centroid data. Typical programming time is under one hour per assembly. The standard SPC software package promotes continuous process improvement by allowing the user to track and eliminate defects on inspected assemblies. www.mirtecusa.com