| Posted by Global SMT & Packaging on 31 March 2008 at 23:00
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Editorial
The dangers of ignoring globalisation
Trevor Galbraith
Technology Focus
Cleaning process integration of cleaning material with cleaning equipment
Mike Bixenman and Steve Stach
Thermal profiling optimizes printed circuit board assembly
Etienne Witte and Paul Austen
Challenges for high density PoP (package-on-package) utilizing SoP (solder-on-pad)
Joanna Kristine Wildhart and Moody Dreiza
Special Features
Case Study: Technology partnership for effective RFID system solutions
Chan Wha Pak/Brian D’Amico Interview—MIRTEC
New Product Focus: VERSAPRINT screen printer
APEX 2008 Exhibitors
Regular Columns
Static Control - Training is Still the Key to Success (Europe edition)
Bob Willis
"REACH for the sky…"—Will the latest bit of environmental legislation be a hold up? (North America edition)
Joe Fjelstad
Practical selection/problems for SMT adhesives (Europe edition)
Bob Willis
Seasonal downturn ending...but global economy remains weak
Walt Custer and Jon Custer-Topai
Other Regular Features
Industry News
New Products
Association News
International Diary
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(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 