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Editorial
The winds of change
Trevor Galbraith

Technology Focus
Tools & methods for lean production management in EA
Dr. T. Nguyen & Vern Harrison

Improving print performance using area ratio sensitivity analysis
Chris Anglin

Wafer-level cavity package with via-through-pad interconnects
Giles Humpston

Nanotechnology and mathematical methods for high-performance thermal interface materials
Sara N. Paisner, PhD

Special Features
Paul Van der Wansem  interview—BTU
APEX report
National Electronics Week technology preview
SMT HYBRID PACKAGING technology preview

Regular Columns
Ball grid array & lead-free assembly defects, part 1
Bob Willis

Change in the electronics industry—slow but inevitable (North American edition)
Joe Fjelstad

Feeling a little bit better about 2008
Walt Custer and Jon Custer-Topai

Other Regular Features
Industry News
New Products
Association News
International Diary

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