Balver Zinn, provider of high-quality anodes with various alloys as well as soft solders and special wires, and Cobar BV, a member of the Balver Zinn Group, will introduce its new XF3 lead-free solder paste.

The XF3 lead-free solder paste was developed to accommodate extended reflow profiles without the use of nitrogen and it completes the family of Cobar products based on Nihon Superior’s patented SN100C-alloy.

SN100C has demonstrated superior long-term fatigue strength over silver-containing SAC-alloys. Being completely free of silver, SN100C shines as the only true remedy against Cu-migration into the Sn regions of the solder joint. With XF3, wetting on all common metal surfaces is excellent, yielding shiny joints reminiscent of leaded solders. It exhibits a robust printing window, printing at 150-200 mm per second. SN100C-XF3 performs better in eliminating voiding when compared to any SAC-alloy.

Balver Zinn offers a coherent system of SN100C soldering materials to customers, ranging from solder bars to cored solder wire, compatible fluxes, and solder paste. The Balver Zinn Group also offers a complete range of SN100C-based hot air leveling products for the board manufacturing industry. www.balverzinn.com

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