Henkel’s breakthrough epoxy flux material, Hysol® FF6000, combines flux functionality and underfill protection into a single material.  A reflow curable material, Hysol FF6000 has been formulated to provide fluxing action for lead-free solder joint formation and, when cured, delivers underfill-like protection against mechanical stress.  The versatility of the material allows for various deposition methods including screen printing, dispensing, dipping and jetting.  In addition, Hysol FF6000 delivers broad application options that offer an in-line, cost-effecitve alternative for such processes as ball attach, Package on Package (POP) assembly, flip chip device and large format BGA and CSP assembly.

The electronics group of Henkel, SMTA International, Booth # 806

www.henkel.com/electronics

Keywords : Special Features, SMT HYBRID PACKAGING 2008, Hysol® FF6000™ Epoxy Flux

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