Regional Sites

Brazil
China
India
Japan
Korea
Mexico

Industry Blogs

Top blogs

"Leading Bond Test Manufacturer DAGE Appoints Inseto As Their New UK & Irish Distributor" PDF Print E-mail
 

Posted by Jade Po Kellard on 13 June 2008 at 06:00

DAGE 4000 Universal Bond TesterDage the industries leading manufacturer for Multi Purpose Bond Testers, has appointed Inseto as their new and Irish distributor.  "We are delighted to have secured the distribution of the Dage Bond Testing Systems, which complements our other leading brands of die and wire bonding equipment and consumable products", said Inseto Sales Director Matthew Brown.

The Dage product line includes their Series 4000 Multi Function Bond Tester, which with over 4000 sold worldwide, is the industries leading modular bond test platform. This system is capable being configured as a simple wire pull tester through to a system capable of performing up to eight different types of test including: wire pull, bond shear, die shear, stud pull, tweezer pull, vectored pull etc.

The 4000 utilises patented frictionless load cartridges and air bearing technologies, which ensure maximum accuracy, repeatability and reproducibility. Cartridges for different applications are readily exchanged and can be stored on the system until required.

Inseto is also offering support for all existing users, including provision of OEM consumable wire pull hooks, shear tools and spare parts, plus calibration, maintenance and equipment recovery by factory trained personnel.

www.inseto.co.uk
www.dage-group.com

   
Quote this article in website
Favoured
Send to friend
Related articles
Save this to del.icio.us

Keywords : Industry News, Europe, "Leading Bond Test Manufacturer DAGE Appoints Inseto As Their New UK & Irish Distributor"


Users' Comments  RSS feed comment
 

Average user rating

   (0 vote)

 


Add your comment
Name
E-mail
Title  
Comment
   Notify me of follow-up comments
   
   

No comment posted



mXcomment 1.0.9 © 2007-2010 - visualclinic.fr
License Creative Commons - Some rights reserved

Featured Interview

Interview - Terry Heilman, Sunstone Circuits
Trevor Galbraith spoke to president and CEO Terry Heilman about what makes Sunstone different from your average board shop.
 

Small Matters

IC Packaging Technology Retrospective – Part 4

The electronics industry’s mantra has for many years been "Smaller, Faster, Lighter, Better and Cheaper."

 

Lead-Free Matters

Measuring package on package-possible procedure, comments welcome

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.

 

Global Business

Year end assessment: the path to recovery
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010.
 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff