Amkor Technology, Inc. announced the introduction of a high-performance flip chip packaging technology using an advanced molding process technology that is expected to provide a number of design, cost and performance advantages for field programmable gate arrays (FPGAs), CPUs, graphics processors, and ASICs.

According to Amkor, this novel molding process establishes a platform technology, with the first package offering for flip chip (over) molded ball grid array called FCMBGA. The process underfills flip chip die with molding compound to provide both mechanical and electrical performance advantages such as:

• Larger die-to-package ratios that reduce package footprints.
• Reduced package warpage for tighter coplanarity control.
• Reduced material stresses.
• Additional mechanical support for heat sink attachment and multi-die designs.
• Improved signal integrity for noise-sensitive high speed signals through the placement of surface mounted passive devices (like decoupling capacitors) closer to the die.
• Reduced signal lengths and power distribution for challenging signal and power integrity requirements by enabling use of coreless or thin core substrates.

"Amkor developed this technology as a cost and performance enhancement to our industry leading SuperFC® package family. The molded structure improves coplanarity without requiring a stiffener, yet offers flexibility for lid attach in large package or high power applications," said Miguel Jimarez, vice president of advanced process development at Amkor.

This is the second package platform introduced by Amkor this year. FusionQuad, a novel lead-frame based package platform, was introduced in February 2008. www.amkor.com

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