Seica has announced the release of a powerful, new software update for the FireFly laser-based selective soldering system. The package includes a completely new automatic development environment, which drastically reduces the program preparation time for soldering printed circuit boards (PCB). Improved algorithms and faster loop control, enables automatic management of PCB characteristics, and environmental factors which result in higher soldering stability and quality.

The unique and precise X-Y-Z control of the laser head, born from Seica’s extensive experience in the development of Flying Probe test systems, enables the Firefly to precisely control the position of the laser beam even rotating it 180 degrees around the pin or joint to be soldered.  Included in the standard features of the FireFly is its ability to recognize fiducial points and compensate for board warpage.

About Seica:
Seica S.p.A, founded in 1986, is a global supplier of automatic test equipment and selective soldering systems with an installed base of more than 800 systems on four different continents.  Seica offers completely automated, laser-based selective soldering solutions, as well as a complete line of test solutions which include bed of nails and flying probe testers. These have the ability to perform manufacturing defect analysis, in-circuit tests, functional tests, and optical tests of loaded boards, second and third level electronic modules, and printed circuit boards. Seica S.p.A corporate headquarters is located in Strambino, Italy, with offices in France (Paris), Germany (Munich), USA (New Hampshire), and China (Suzhou), along with a worldwide distribution network.

www.seica.com

Keywords : Products News, New Products, Seica Issues a New Software Release for the FireFly

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