Regional Sites

Brazil
China
India
Japan
Korea
Mexico

Industry Blogs

Top blogs

Thermo Fisher Scientific Will Demonstrate Solutions for RoHS Compliance Screening at SMTA Int'l PDF Print E-mail
 

Posted by Jade Po Kellard on 21 July 2008 at 06:00

Thermo Fisher Scientific Inc., the world leader in serving science, will demonstrate its third-generation handheld Thermo Scientific Niton XL3 700 Series x-ray fluorescence (XRF) analyzers at SMTA International 2008, Booth #309. These instruments provide the fastest solder alloy grade identification and laboratory-quality composition analysis of plastics and polymers ever performed with a handheld XRF analyzer. Typical time for routine solder screening measurements is less than 5 seconds - as much as 2 ½ times faster than our previous generation of analyzers. The XL3t features a 50 kilovolt, 2-watt x-ray tube, the highest power x-ray tube ever offered in a handheld XRF analyzer, as well as advanced electronics that enable a host of new features directly benefiting the customer.  Thermo Fisher Scientific is the world’s leading manufacturer of handheld XRF analyzers.

Thermo Scientific Niton XL3 instruments give component manufacturers, distributors, OEMs, recyclers and others the fast, accurate, easy-to-use analytical tools they need to test parts and finished goods for compliance with RoHS, China ROHS, WEEE and other regulations.

The XL3 700 Series offers many benefits including:

Component testing: The XL3’s higher speed and lower element detection limits enable users to screen incoming components faster. The 50 kV x-ray tube, improved source filtering and advanced analog and digital electronics produce more precise and accurate results for every measured element – particularly cadmium, which must be accurately measured at low concentrations for RoHS-WEEE compliance.

Solder analysis: The XL3’s superior testing speed and low element detection limits enable users to closely monitor concentrations of lead, copper and other elements in solder, expediting electronics manufacturing and minimizing the need to send solder samples to laboratories for destructive testing.

Switchable small-spot focus: XL3 Series XRF analyzers with optional small spot analysis hardware let users select either 8 mm diameter or 3 mm diameter analysis spot size for each measurement. This stand-out feature allows users to screen larger areas of printed circuit boards and other heterogeneous samples quickly; but, when smaller components need analysis in isolation, users can switch in seconds to measure a 3 mm diameter spot on the sample.  An internal color CCD camera allows users to pinpoint areas of interest and store an image of the tested area with their XRF analytical results for recordkeeping and documentation.

For more information in advance of SMTA International, or to schedule an on-site demonstration, contact your local Niton Analyzers representative or contact the Thermo Scientific Niton Analyzers business unit directly at (800) 875-1578 (toll-free US), +1 978 670-7460, by e-mail at niton@thermofisher.com or by visiting our website at http://www.thermo.com/niton.

   
Quote this article in website
Favoured
Send to friend
Related articles
Save this to del.icio.us

Keywords : Special Features, SMTAI 2008, Thermo Fisher Scientific Will Demonstrate Solutions for RoHS Compliance Screening at SMTA Int'l


Users' Comments  RSS feed comment
 

Average user rating

   (0 vote)

 


Add your comment
Name
E-mail
Title  
Comment
   Notify me of follow-up comments
   
   

No comment posted



mXcomment 1.0.9 © 2007-2010 - visualclinic.fr
License Creative Commons - Some rights reserved

Featured Interview

Bryan Gass—Techcon Systems

Bryan talks to Trevor Galbraith about why he believes that implementing a rigid strategy now will strengthen Techcon Systems in these challenging times and beyond.

 

Small Matters

Synergy, the Occam process and twisted wire interconnect

The term/concept of synergy seems very apt when applied to the interaction of the Occam process solderless assembly concept in combination with a unique PCB interconnection technology called twisted wire interconnect or TWI.

 

Lead-Free Matters

Measuring package on package-possible procedure, comments welcome

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.

 

Global Business

Year end assessment: the path to recovery
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010.
 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff