| Posted by Jade Po Kellard on 25 July 2008 at 06:00
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ZESTRON America is pleased to introduce its newly developed FAST (Fast Acting Surfactant Technology)  echnology.
FAST Technology based cleaning agents are a proprietary mix of newly developed surfactants, which allows for a quicker removal of a wide variety of the latest lead–free and eutectic flux residues.
When compared to traditional surfactant–based cleaning agents, this new technology removes flux residues under 1 MIL standoff components at a 1.7ft/min. belt speed and requires a reduced amount of active ingredients for the complete removal of contaminants from substrate surfaces. FAST Technology’s solid–free formula leaves no residues either on the substrates surface or within the equipment. FAST Technology cleaning agents such as the ATRON AC 205 can be used as a drop–in replacement for high and medium pressure, inline and batch cleaning systems. Furthermore, FAST™ Technology cleaning agents are guaranteed to meet the highest cleaning requirements such as the IPC 610, the J–STD 001 as well as the IPC–TM 650.
In–depth and detailed free–of–charge cleaning experiments using FAST Technology cleaning agents can be completed in ZESTRON America’s Application Technology Center featured with a variety of cleaning processes including inline, batch and ultrasonic cleaning.
For more information regarding the FAST Technology and additional ZESTRON products and services, please contact us at infousa@zestron.com or visit us online at www.zestron.com. |
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued "recovery" in 2010. 