| Posted by Jade Po Kellard on 12 August 2008 at 06:00
|
ASC International announces that it will highlight its most advanced true 3D SPI systems at booth 206 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008 in Orlando, FL.
ASC International will be demonstrating the latest advancements in a full line of products including the LaserVision SP3D and the VisionMaster AP450 series of solder paste inspection systems. Providing the highest level of measurement capability in their respective classes, each system offers the most economical solution for bench-top SPI on the market today.
The LaserVision SP3D combines laser-based technology with auto-measurement accuracy. Real-time SPC data collection and analysis along with the lowest cost of ownership in the World makes the SP3D a best buy.
The VisionMaster AP450 combines structured white light technology with fully programmable auto-positioning accuracy. Real-time SPC data collection and analysis, Offline programming, and the most advanced True 3D measurement capabilities makes the AP450 the right choice for high speed sample-based SPI requirements.
For more information, visit www.solderpasteinspection.com or www.ascinternational.com or contact the company at 1799 County Road 90, Suite 9 Maple Plain, MN 55359 USA Telephone: 888-478-2912 Fax: 763-478-6206. |
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(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 