| Posted by hglackey on 14 August 2008 at 17:18
|
Download the full magazine as a PDF for FREE:
 Editorial
Solar technology clouds the landscape
Trevor Galbraith
Technology Focus
Advances in solder ball placement for surface-mountable packages
Tom Falcon, DEK Printing Machines Ltd
Understanding hidden reactions and the importance of profile in reflow soldering, part 2
Dr. S. Manian Ramkumar, Mr. Anand Kannabiran and Ms. Aarthi Baskaran, CEMA at RIT; Dr. Viswam Puligandla; Mr. Bjorn Dahle, KIC
Parallel print & inspection processes to achieve 100% post-print inspection
Wolfram Hübsch, ERSA GmbH
Special Features
Company Profile: NBS Design
Case Study: KIC’s 24-7 continuous monitoring system helps Paramit meet its zero-defects objective
Interview—Don Naugler, VJ Electronix, Inc.
SMTA International 2008 Show Preview
GlobalTRONICS 2008 Show Preview
SEMICON West continues to thrive
Regular Columns
Wafer level packaging and the third dimension
Joe Fjelstad
SMART Group launches “Lead-Free Process Defect Guide 2”
Bob Willis
Seasonal upturn imminent but soft demand through 2009
Walt Custer and Jon Custer-Topai
Update on lead-free solder joint reliability
Werner Engelmaier
Other Regular Features
Industry News
Association News
International Diary
|
Global SMT RSS feed
(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 