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Editorial
Is the “Faster, Smaller, Cheaper” model broken?
Trevor Galbraith

Technology Focus
Optimizing batch cleaning for removing lead-free flux residues on PCAs
Steve Stach, Austin American Corporation, and Mike Bixenman, DBA, Kyzen Corporation

Compatibility of polymers and fluxes: Getting to the heart of the matter
Andy Mackie, Ph.D., and Christopher Nash, Indium Corporation

A Breath of Fresh Air
Claude W. “Bubba” Powers, Cooper Hand Tools

Special Features
Interview: Neil MacRaild—Ovation Products
Show report: SMTAI survives Fay
Show preview: IPC Midwest 2008

Regular Columns
Overlapped package structures—another option for space savings
Joe Fjelstad

PCB solderability changes with time—what finish is best?
Bob Willis

Decent start in 2008—what about the next 18 months?
Walt Custer and Jon Custer-Topai

Forum on reliability for pb-free electronics
Werner Engelmaier

After-market services
Folkert Wierda and Ted Gardham

Other Regular Features
Industry News
New Products
Association News
International Diary

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