Regional Sites

Brazil
China
India
Japan
Korea
Mexico

Industry Blogs

Top blogs

AdTech Ceramics to exhibit at Electronica 2008 PDF Print E-mail
 

Posted by Jade Po Kellard on 24 October 2008 at 06:00

AdTech Ceramics will participate in Electronica 2008 with sister company Statek Corporation of Orange, California this year In Area B6, Booth 456.

AdTech Ceramics produces custom multilayer co-fire ceramic packages in 92% alumina (HTCC), Aluminum Nitride (AlN) and LTCC materials. In addition, ceramic/metal package assemblies are also available. A new HD Alumina system has been released for thin film applications with a surface finish of five microinches or better. In addition the 92% alumina base HTCC material can be formed and metallized using an injection molding process for complex shape requirements. Chemical milling of materials, including Kovar, Alloy 42, Stainless and Spring Steel, is available for various products to include step lids, lead frames, seal rings and other custom products. These capabilities are used in applications for Medical, Military, Optoelectronics, High Frequency, High Temp Electronics and High Reliability Industrial applications. Products available include the following:

•  Optical, Imaging & Sensor Packages
•  Custom Pin Grid Arrays
•  Multichip Modules, Substrates & Packages
•  Microwave packages
•  Crystal/Oscillator/Saw Packages
•  High Frequency Feedthroughs
•  Power Dissipation Packages
•  Custom Advanced Packages

AdTech's manufacturing facility has a 30+ year history of designing, tooling and manufacturing multi-layer ceramic packages and feedthroughs and includes a full microwave modeling and custom design center. The U.S.A.-based company is ISO 9001:2000 certified.

AdTech Ceramics' experienced employee base has a 100+ year legacy of ceramic expertise, including material science, engineering, design, tooling and manufacturing of multilayer ceramics, as well as chemically milled metal components and injection molded products.

For more information, please visit www.adtechceramics.com or e-mail sales@adtechceramics.com

   
Quote this article in website
Favoured
Send to friend
Related articles
Save this to del.icio.us

Keywords : Special Features, Electronica 2008, Munich, AdTech Ceramics to exhibit at Electronica 2008


Users' Comments  RSS feed comment
 

Average user rating

   (0 vote)

 


Add your comment
Name
E-mail
Title  
Comment
   Notify me of follow-up comments
   
   

No comment posted



mXcomment 1.0.9 © 2007-2010 - visualclinic.fr
License Creative Commons - Some rights reserved

Featured Interview

Bryan Gass—Techcon Systems

Bryan talks to Trevor Galbraith about why he believes that implementing a rigid strategy now will strengthen Techcon Systems in these challenging times and beyond.

 

Small Matters

Synergy, the Occam process and twisted wire interconnect

The term/concept of synergy seems very apt when applied to the interaction of the Occam process solderless assembly concept in combination with a unique PCB interconnection technology called twisted wire interconnect or TWI.

 

Lead-Free Matters

Measuring package on package-possible procedure, comments welcome

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.

 

Global Business

Year end assessment: the path to recovery
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010.
 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff