| Posted by Jade Po Kellard on 27 October 2008 at 06:00
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From November 4 - 5, 2008, the China SMT Forum will be held at the Sheraton Shanghai Grand Tai Ping Yang Hotel. The highly specialised conference convenes international opinion leaders in electronic packaging and assembly technology and focuses on the demands of the Chinese market. The China SMT Forum is organised by Business Media China AG in cooperation with the Shanghai Science & Technology Development and Exchange Center. The Fraunhofer Institute for Reliability and Microintegration and the German association VDMA Productronics support the event.
Conference Program
The China SMT Forum will stage a two-day conference which comprises six sessions with 22 presentations held by distinguished industry experts. The top-notch conference program was developed by a conference committee under the chairmanship of Prof. Mathias Nowottnick from the University of Rostock and focuses on the topics “Reliability and Testing”, “Semiconductor Packaging and Power Electronics”, “Lead-free Soldering and RoHS-conform Technologies”, “PCB Technologies, Surface Finishes and Quality”, and “Assembling and Soldering Technologies”.
Among the renowned speakers is Prof. Dr. Jürgen Wilde from IMTEK of the University of Freiburg, who will present a lecture titled “Analysis of Stress in the Packaging of Sensors, MEMS and Microsystems”. In his presentation, Prof. Wilde will evaluate and demonstrate the potential of modern experimental methods for the thermo-mechanical analysis of area-array packages.
Dr. Hans Bell from Rehm Thermal Systems GmbH will present the keynote speech of the session “Lead-free soldering and RoHS-conform Technologies”. In his presentation “Lead-Free Reflow Soldering”, Dr. Bell will discuss how different soldering processes – namely convection and condensation (vapour phase) – influence the thermal stability of the components under test during the soldering process. Furthermore, he will point out to what extent the reflow parameters of the lead-free process influence soldering defects.
“The Development of the SMT Market in China” will be presented by Mr. Jin Cunzhong from the China Electronic Production Equipment Industry Association. Prof. Mathias Nowottnick from the University of Rostock and Prof. Hans-Juergen Albrecht from the Corporate Technology Department of Siemens AG will also present keynote speeches at the China SMT Forum 2008.
Delegate Passes Almost Sold
The sales of the delegate passes have proceeded very successfully. Particularly Chinese enterprises showed a strong interest in the highly specialised event. Additionally, numerous international companies will attend the conference. The organiser of the China SMT Forum expects an audience of 200 decision makers and engineers of microelectronic manufacturers and SMT-related equipment suppliers.
www.chinasmtforum.com |
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Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 