Global SMT & Packaging magazine - 8.11  November 2008

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8.11 – November 2008

Posted by hglackey on 13 November 2008 at 12:07

Read the European edition online, with page-turning, note-taking and bookmarking capability, or download the PDF.

Read the North American edition online, with page-turning, note-taking and bookmarking capability, or download the PDF.

Editorial
Nothing stands still
Trevor Galbraith

Technology Focus
Test data requirements for assessment of alternative Pb-free solder alloys
Helen Holder, Gregory Henshall, Aileen Maloney, et al, Hewlett-Packard Company

Lasers—a flexible tool for PCB and device rework
Bob Wettermann, CIT, BEST Inc.

Can lead-free and lead-containing PCBs be cleaned in a single process?
Dipl. Ing. Stefan Strixner, ZESTRON Europe

Special Features
Interview: John Hartner—Dover Electronic Technologies
Global Technology Awards winners

Regular Columns
Introduction to microsectioning printed circuit boards
Bob Willis

Sober outlook . . . not a big surprise
Walt Custer and Jon Custer-Topai

Other Regular Features
Industry News
New Products
Global SMT & Packaging Around the World
Association News
International Diary

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2009 Show Preview

Featured Interview

Bryan Gass—Techcon Systems

Bryan talks to Trevor Galbraith about why he believes that implementing a rigid strategy now will strengthen Techcon Systems in these challenging times and beyond.

Small Matters

IC Packaging Technology Retrospective – Part 4

The electronics industry’s mantra has for many years been "Smaller, Faster, Lighter, Better and Cheaper."

Lead-Free Matters

Measuring package on package-possible procedure, comments welcome

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.