| Posted by hglackey on 18 November 2008 at 08:10
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 John Hartner is one of the most switched on and dynamic CEOs in our industry. He has risen through the ranks at Universal, DEK and Dover and is now overseeing several Dover Electronic Technologies companies, including household names such as DEK, Everett Charles Technologies (ECT), Multitest, atg-L&M, OK International and others.
Hartner has a sound grasp of the business and market dynamics as well as a deep understanding of the manufacturing and assembly process. He is currently chairman of SMEMA (Surface Mount Equipment Manufacturers Association), which is part of IPC, and is a keen strategist. As if that is not enough, he also spent 10 years in the field in China and speaks some Mandarin.
Indeed, it was during a recent visit to China that I caught up with him. Here are some of topics we discussed.
Download the PDF of this interview, or read it in the electronic edition of Global SMT & Packaging 8.10 - October 2008.
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 