Regional Sites

Brazil
China
India
Japan
Korea
Mexico

Industry Blogs

Top blogs

Nepcon China Moves to Prestigious Shanghai World Expo Venue for 2011 Event PDF Print E-mail
 

Posted by Jade Po Kellard on 27 November 2008 at 06:00

Reed NEPCON ChinaIn 2011 the NEPCON China Exhibition will be held at the Shanghai World Expo Venue (WEV).  This new venue will offer exhibitors and visitors unparalleled facilities, unlike any other electronics industry event in the region. Its state-of-the-art infrastructure, meeting facilities, accessibility and hotel support will ensure the success of the event and secure its future growth for years to come. To honour its commitment to the future of the SMT and electronics manufacturing industry in China, Reed Exhibitions entered into the agreement with the Shanghai World Expo (Group) Co. Ltd, made official during a signing ceremony held on the 26th November 2008.

Reed Exhibitions highly successful NEPCON China Exhibition in Shanghai, which was honored UFI approved event recently, continues to meet and exceed expectations year on year, as one of China’s largest and most successful SMT and electronics manufacturing event.  The 2008 show welcomed in excess of16,000 visitors over four days, from across China and the globe and has already sold 80% of the floor space for 2009.  The success of the NEPCON China event is attracting requests from more and more overseas exhibitors and visitors and the venue must be able to respond to support the electronics manufacturing industry in China. This continued growth pattern and a genuine loyalty for this industry event prompted the organisers to put plans in place to move to another prestigious venue for the 2011 exhibition.

The new venue will be finalised by 2011 and will provide China’s SMT and electronics manufacturing industry and its overseas supporters with a first-class, modern exhibition hall -unrivalled in the region. Visitors to the event will have convenient access to restaurants and accommodation facilities nearby the new venue. This will enable Reed Exhibitions to continually improve the management and services at the event and to build a platform from which to provide increasing business opportunities for both domestic and overseas exhibitors and visitors.

Careful consideration was given to a venue that would offer NEPCON China the ability to adapt and react to the dynamics of this fast paced industry.  The Shanghai World Expo (Group) Co. Ltd., venue, WEV, is by far the preferred venue of choice for new shows being launched in Shanghai. This new agreement will also enable Reed Exhibitions and The Shanghai World Expo (Group) Co. Ltd., to work together to continually explore possibilities for new events in Shanghai and other cities across China.

With the 2009 event just months away, the industry is preparing for the exciting new initiatives Reed Exhibitions will launch for next year to attract even more visitors.  To provide just a snapshot, they will include a special summit to be held prior to the event, tailored to cater specifically for the needs of the Purchasing Manager.  A high level conference will be held concurrently with the show and a live demonstration will be available for engineers to learn about the entire SMT line. An e-Nepcon programme will see members of the online industry tool SMT Home gather during the event, to network and to celebrate the collaboration between Reed and SMTHome.  Lastly, for now, a Guru Corner programme will be launched on the website, with a monthly topic being featured on the e-NEPCON website to encourage ongoing discussion.

NEPCON China will once again host the prominent industry body SMTA, with the SMTA China Chapter providing an SMTA China East Conference programme that will again prove a ‘must attend’ attraction.  The programme design is underway to address the industry's most pressing issues concerning electronics manufacturing, advanced packaging and lead-free reliability.  For more information, please visit: www.nepconchina.com.

   
Quote this article in website
Favoured
Send to friend
Related articles
Save this to del.icio.us

Keywords : Industry News, China, Nepcon China Moves to Prestigious Shanghai World Expo Venue for 2011 Event


Users' Comments  RSS feed comment
 

Average user rating

   (0 vote)

 


Add your comment
Name
E-mail
Title  
Comment
   Notify me of follow-up comments
   
   

No comment posted



mXcomment 1.0.9 © 2007-2010 - visualclinic.fr
License Creative Commons - Some rights reserved

Featured Interview

Bryan Gass—Techcon Systems

Bryan talks to Trevor Galbraith about why he believes that implementing a rigid strategy now will strengthen Techcon Systems in these challenging times and beyond.

 

Small Matters

Synergy, the Occam process and twisted wire interconnect

The term/concept of synergy seems very apt when applied to the interaction of the Occam process solderless assembly concept in combination with a unique PCB interconnection technology called twisted wire interconnect or TWI.

 

Lead-Free Matters

Measuring package on package-possible procedure, comments welcome

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.

 

Global Business

Year end assessment: the path to recovery
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010.
 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff