| Posted by hglackey on 05 December 2008 at 08:34
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Read the European edition online, with page-turning, note-taking and bookmarking capability, or download the PDF.
Read the North American edition online, with page-turning, note-taking and bookmarking capability, or download the PDF.
Editorial
A world of opportunity
Trevor Galbraith
Technology Focus
Molded underfill process for the SiP
Tae Hyun Kim, Ki Chan Kim, Sung Yi, Dong-Kuk Kim, Tae Sung Jung, Jin Su Kim, and Joseph Y. Lee, Samsung Electro-Mechanics Co., Ltd.
Thermally conductive liquid materials for electronics packaging
Sanjay Misra, Ph.D., The Bergquist Company
Reflow significance on package-on-package reflow assembly
S. Manian Ramkumar, Ph.D., RIT, and Brian O’Leary, KIC
Special Features
Interview: David Suihkonen—R&D Technical Services
2008 World Distributor Revie
European Electronics Assembly Reliability Summit repor
CEMCONEX report
Regular Columns
Vapour phase or convection for lead-free? (Europe edition)
Bob Willis
A visit to CERN (and the impressive electronics R&D center hidden within) (North America edition)
Joe Fjelstad
Downturn through 2009 (being blunt)
Walt Custer and Jon Custer-Topai
A creep-fatigue model for SAC405/305 solder joint reliability estimation—a proposal
Werner Engelmaier
Other Regular Features
Industry News
New Products
Global SMT & Packaging Around the World
Association News
International Diary
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