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Can lead–free and lead containing PCBs be cleaned in a single process? PDF Print E-mail
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Posted by Dipl. Ing. Stefan Strixner on 10 December 2008 at 16:19

This article describes a study recently conducted by Zestron for better understanding the risks of cleaning lead-free and lead-containing assemblies together in a single process.

By conducting cleaning trials and laboratory analysis as well as analyzing customer bath samples, the risk of a cross-contamination of the lead-free assemblies with lead was examined. The study showed that using modern cleaning technologies, the limits for lead content on lead-free assemblies set forth by RoHS and WEEE are not exceeded. 

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Keywords : Lead-Free Residues, Lead-Containing Assemblies, Cleaning Process


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