1-part and 2-part liquid adhesives and sealants have long been part of the materials portfolio used in electronics packaging. More recently, with thermal management needs, we have seen the advent of thermally conductive liquids as gap fillers and adhesives for providing a conductive pathway for heat. Thermally conductive liquids, while similar to their predecessors in many respects, also differ in some very significant ways. The rheology, handling and dispensing characteristics of these materials are quite distinct. The significant advantages of using thermally conductive liquids can best be realized when understanding some fundamental characteristics of these materials. We will present the performance, manufacturing and reliability issues related to thermally enhanced liquids (adhesives and gap fillers). Significant differences vis-à-vis solid pad like materials and unfilled liquids will be contrasted. We will provide insights into storage, handling, dispensing and reliability of such materials. 

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Keywords : Fillers, dispersions, rheology, thermal conductivity, dispensing, manufacturing

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