| Posted by Bob Willis on 09 January 2009 at 16:40
|
 Vapour phase soldering (VPS) has been around in the industry for many years and was one of the only two serious options during the early introduction of surface mount technology. In the early days, engineers had the option of brown belt for single-sided products, infrared and VPS. With the increasing availability of batch and inline VPS equipmen,t the market is likely to grow to 10% compared to the dominant position held by convection systems. The first reflow system used by this author was VPS, preferring the simplicity of the process and process set-up over the problems of accurate loading, board/belt positioning, profiling and over heating of paste causing flux residue charring.
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 