Bryan talks to Trevor Galbraith about why he believes that implementing a rigid strategy now will strengthen Techcon Systems in these challenging times and beyond.

The term/concept of synergy seems very apt when applied to the interaction of the Occam process solderless assembly concept in combination with a unique PCB interconnection technology called twisted wire interconnect or TWI.

Inevitably all stencils need to be cleaned to remove solder paste residues from the surface of the foil and from the apertures to prevent it drying and giving missed/incomplete prints.