January 2009 (Volume 9, Issue 1)

Read the European edition online, with page-turning, note-taking and bookmarking capability, or download the PDF.

Read the Americas edition online, with page-turning, note-taking and bookmarking capability, or download the PDF.

Editorial
Strategies for the economic downturn
Trevor Galbraith

Technology Focus
Electrostatic discharge (ESD) and automated handling processes
Dipl.-Ing. Hartmut Berndt, B.E.STAT European ESD Competence Centre

PCB layout and soldering nozzle design in selective soldering processes
Reiner Zoch, SEHO Systems GmbH

Supporting niche service needs at a regional level—a case study
Barry Reece and Ken Russell, Clover Electronics

Special Features
Four industry suppliers come of age....
Interview: Kyle Doyel—KYZEN Corporation

Regular Columns
Microelectronics Assembly and Packaging (MAP) workshop 2008 review (Americas edition)
Joe Fjelstad

Double-sided reflow in one reflow cycle (European edition)
Bob Willis

2009: Very little smooth sailing until at least summer
Walt Custer and Jon Custer-Topai

Other Regular Features
Industry News
New Products
Global SMT & Packaging Around the World
Association News
On Globalsmt.net
International Diary 

Average user rating

   (0 vote)