| Posted by Bob Willis on 09 February 2009 at 14:11
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In any process there are always opportunities to improve, reduce the number of process stages or reduce the cost of manufacture. Each may not improve yield initially, may even increase manufacturing defects, but it must in time benefit some companies’ processes or products. Engineering is always looking at alternative processes, and simultaneous double-sided reflow (SDSRS) is a possible new candidate for investigation. It has been used by two Japanese companies, one large computer manufacturer in the USA, and is reportedly being used by one other company in Europe. It was originally patented by one large US producer.
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 