The ability to reduce production costs while maintaining a consistent high quality is essential. Densely  populated multilayer boards and miniaturized, high-pin-count, fine-pitch devices cannot be efficiently repaired with high quality. Manual repair soldering processes can cause enormous thermal problems with lead-free applications. ‘Hidden costs,’ such as productivity rates, operator training and damaged assembly costs, have to be taken into consideration as well—the target, therefore, is a zero-fault selective soldering process.

Appropriate printed circuit board design is important: pad shapes, their distance in relation to each other, the distance between a pad to be soldered and an adjoining one that is not to be wetted, the distance between individual pins, the length of these pins—all need to be taken into account.

Choosing the correct soldering nozzle is the other half of the equation.

This paper gives a detailed explanation of the individual points that should be found in the selective soldering process with regard to the assembly design and solder nozzle technology. 

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