| Posted by Global SMT & Packaging on 20 February 2009 at 06:00
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NEPCON China 2009 will once again be held in Shanghai’s Everbright Convention & Exhibition Centre, from April 21 – 24. In this uncertain global economic climate, Reed Exhibitions will once again use its extensive resources and expertise to ensure NEPCON China 2009 remains in tune with the exact needs of the industry during these challenging times.
Nepcon China is the leading business platform in the electronics manufacturing industry and continues to attract famous brands such as Assembleon, Agilent Technologies, SIEMENS, SONY, HITACHI, SAMSUNG, Panasonic, FUJI, SAKI and Henkel. Their support is a firm acknowledgment that NEPCON China will once again deliver the only true solution for the Chinese marketplace.
NEPCON China will keep its promise by providing an even more diverse range of attractions to support the Chinese marketplace it serves. With more than 90 percent of floor space booked, the 2009 show has already attracted new participants including Hexagon Metrology, Avantec, Worco and FUJI Chemical. Proving that in difficult times companies are making informed decisions when deploying their budgets, to guarantee the broadest industry reach that the NEPCON brand offers.
Featuring a comprehensive range of innovative SMT products and technologies, the event continues year on year to bring the entire world of SMT to our doorstep, testimony that NEPCON China remains among the largest and longest-standing trading and sourcing platforms for the SMT industry in China. The NEPCON brand delivers an unrivalled platform from which to source the latest products, gather up-to-the-minute market information and learn about the latest technologies China - and the world - has to offer.
Among the attractions in April will be the 3G Day, which will gather professionals from the communications industry to share the developing trend of the 3G business. Organisers of the 3G Day, the Youth Daily and Reed Exhibitions, together with industry specialists, have been proactive in obtaining detailed analysis of the latest technologies and opportunities in the SMT marketplace. They have combined their strengths to create new advantages for exhibitors and visitors of the 2009 event. A series of themed activities with focus on the development of the 3G Mobile and will enable visitors to achieve the most value from their time at the event.
Education is a vital element in the success of NEPCON China and the 2009 event will once again host the prominent industry body SMTA. SMTA China Chapter will work in conjunction with the event to provide an SMTA China Conference program that will once again prove a “must attend” attraction for visitors.
Additionally, acting as the industry’s educational platform, more than 10 major EMS and manufacturing companies will be invited to hold their annual staff meeting and training sessions during the four-day exhibition. In addition to the learning and training opportunities offered at the event, they will have an opportunity to walk the show floor to acquaint themselves with the latest technologies in the industry they work in.
On top of that, a high-level business conference catered for the industry’s decision makers will be an attraction for top executives from major electronics manufacturers.
For the first time in the electronics manufacturing event in China, NEPCON China 2009 will feature a full demonstration line equipped with printer, pick-and-place machine, oven and soldering machine in action. The new attraction is designed to provide visitors with a full insight into today’s SMT manufacturing line. Li Ming a senior purchasing manager at Alcaltel, said, “We cannot wait until the show opens. The demonstration line is definitely not to be missed!"
Josephine Lee, East China Vice President, Reed Exhibitions explains, “We have retained the confidence in the Chinese market. In the current global economic climate we will once again pull on our extensive resources and expertise to ensure NEPCON China 2009 is a show to help boost the industry in these challenging times, and provide welcome support as companies enter the second quarter of 2009.”
To support China’s largest, oldest and most comprehensive trade and procurement platform for the SMT industry, visit www.nepconchina.com. |
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(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 