Regional Sites

Brazil
China
India
Japan
Korea
Mexico

Industry Blogs

Top blogs

Enthone Appoints Pat Creque Sales Manager, US Eastern Region PDF Print E-mail
 

Posted by Jade Po Kellard on 05 March 2009 at 06:00

Pat CrequePat Creque has been appointed Sales Manager - US Eastern Region by Enthone Inc., a business of Cookson Electronics.  Mr. Creque will be responsible for leading and growing the sales of the company’s full line of surface finishing and electronic chemical products throughout the Eastern United States.

Mr. Creque brings a wealth of experience to Enthone customers, having served in a broad range of sales management, marketing and senior management positions at proprietary chemical companies throughout his 30+ year career. Prior to joining Enthone, Mr. Creque’s worked at Specialty Chemicals and Services, Novamax, Houghton, and Henkel.

Mr. Creque has served on a number or industry association committees and boards, including the AESF and the American Architectural Manufacturers Association. He is based out of Atlanta, Georgia and is equipped with the committed support of Enthone’s US Eastern Sales and Technical Service Team to serve customers throughout the Eastern Region.

Enthone Inc. is a business of Cookson Electronics. The company is a leading supplier of high performance specialty chemicals and coatings used in the electronics and surface finishing industries. Enthone manufactures, markets and distributes its functional, decorative and electronic processes that are used in printed wiring board, semiconductor, photovoltaic, automotive, aerospace, jewelry, and plumbing applications.

www.cooksonelectronics.com

   
Quote this article in website
Favoured
Send to friend
Related articles
Save this to del.icio.us

Keywords : Industry News, America, Enthone Appoints Pat Creque Sales Manager, US Eastern Region


Users' Comments  RSS feed comment
 

Average user rating

   (0 vote)

 


Add your comment
Name
E-mail
Title  
Comment
   Notify me of follow-up comments
   
   

No comment posted



mXcomment 1.0.9 © 2007-2010 - visualclinic.fr
License Creative Commons - Some rights reserved

Featured Interview

Bryan Gass—Techcon Systems

Bryan talks to Trevor Galbraith about why he believes that implementing a rigid strategy now will strengthen Techcon Systems in these challenging times and beyond.

 

Small Matters

Synergy, the Occam process and twisted wire interconnect

The term/concept of synergy seems very apt when applied to the interaction of the Occam process solderless assembly concept in combination with a unique PCB interconnection technology called twisted wire interconnect or TWI.

 

Lead-Free Matters

Measuring package on package-possible procedure, comments welcome

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.

 

Global Business

Year end assessment: the path to recovery
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010.
 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff