• Strain gage testing: the delta effect of thermal cycle testing
  by Mark T. McMeen
• Resolution of solder voids in pin–in–hole product by Condia Yu, Eddie W. W. Tang, Jack To, Ka Wai Chan, Brian Carlson, Rick Chen, PS Hou, Phil Isaacs, Eddie Kobeda, Sunil Nigam, Jeffrey Taylor & Kaspar Tsang.
• A new angle on printing
  George Babka, Scott Zerkle, Frank Andres, Rahul Raut, Westin Bent and Dave Connell

And more!

February 2009 (Volume 9, Issue 2)

Read the European edition online, with page-turning, note-taking and bookmarking capability, or download the PDF.

Read the Americas edition online, with page-turning, note-taking and bookmarking capability, or download the PDF.

Editorial
Protectionism is not the answer
Trevor Galbraith

Technology Focus
Strain gage testing: the delta effect of thermal cycle testing
Mark T. McMeen, STI Electronics, Inc.

Resolution of solder voids in pin-in-hole product Condia Yu, Eddie W. W. Tang, Jack To & Ka Wai Chan, Elec & Eltek, and Brian Carlson, Rick Chen, PS Hou, Phil Isaacs, Eddie Kobeda, Sunil Nigam, Jeffrey Taylor & Kaspar Tsang, IBM and IBM China.

A new angle on printing
George Babka and Scott Zerkle, Assembléon Americas; Frank Andres, Rahul Raut and Westin Bent, Cookson Electronics Assembly Materials; and Dave Connell, Research in Motion

Special Features
NBS turns over a new leaf: Michael Maslana interview (Americas edition)

Interview: Keith Bryant—SMART Group (European edition)

Regular Columns
IC packaging technology retrospective—part 1 (Americas edition)
Joe Fjelstad

General guide to solder balls in wave soldering—now you see them, now you don’t (European edition)
Bob Willis

2009 & 2010: The coming global recovery
Walt Custer and Jon Custer-Topai

Other Regular Features
Industry News
New Products
Global SMT & Packaging Around the World
Association News
On Globalsmt.net
International Diary 

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