Indium Corporation’s vice president of technology, Dr. Ning-Cheng Lee, has been appointed to the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society Board of Governors.

Dr. Lee leads the Indium Corporation team of technology experts. He was named SMTA Member of Distinction in 2002, received the Soldertec Global Lead-Free Solder Award in 2003, and most recently received the 2006 CPMT Exceptional Technical Achievement Award. Dr. Lee’s credits also include service as an SMTA board member, liaison to the Taiwan SMTA chapter, coordinator and chair of the entire 2005 Nepcon Shanghai technical program, and author of two books and over 100 technical papers.

Dr. Lee, a world-renown electronics assembly materials expert, has extensive experience in the development of solders, fluxes, high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost ownership.

IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacture. For more information visit, www.cpmt.org

Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world’s premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered. www.indium.com

Keywords : Indium, Ning-Cheng Lee, CPMT

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