| Posted by Jade Po Kellard on 31 March 2009 at 06:00
|
3M, a pioneer in static control products and electrostatic discharge event measurement devices, will demonstrate several industry-leading products and technologies at booth #773 at the 2009 IPC Printed Circuits Expo, APEX and the Designers Summit, Mar. 31-April 2 at the Mandalay Bay Resort and Convention Center in Las Vegas.
In addition, 3M's Joel Peiffer will be participating in a session on Thursday, April 2 discussing the performance and stability of embedded capacitor technology. Joel will present his paper, "Embedded Passives Become Mainstream Technology, Finally!" The session code is S26. The discussion will be moderated by Dennis Fritz of MacDermid, Inc. and will be held at 9 a.m.
3M has long been a leader in providing static control solutions to companies around the world. Eliminating the damage caused by static electricity, EMI and micro-contaminations requires a complete static control program. 3M provides a full range of packaging, workstation and instrumentation product solutions which are designed to help electronic products manufacturers develop and maintain complete ESD control programs. The updated Static Control product catalog from 3M Electronics Solutions Division features 140 pages of electrostatic discharge solutions from the industry leader. The catalog is currently available online from www.3m.com/static.
The Spring 2009 issue of 3M Static Digest is also available. Written specifically for the ESD industry, Static Digest is one of the most recognized newsletters in the ESD industry. The spring issue features articles on ESD consultants and the 3M tools these industry experts use, questions about calibration and packaging for JEDEC-033. The newsletter is accessible online at:
http://multimedia.mmm.com/mws/mediawebserver.dyn?6666660Zjcf6lVs6EVs66sW_KCOrrrrQ-
About 3M Electronic Solutions Division
3M Electronics Solutions Division offers innovative solutions to the electronics market, such as static control products; copper interconnect systems; cables and cable assemblies; carrier and cover tapes and trays; flexible circuits; embedded capacitor materials; and Textool brand test and burn-in sockets. For more information on interconnect solutions available from the 3M Electronic Solutions Division, visit www.3MStatic.com |
Global SMT RSS feed
(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 