While already in widespread use in the consumer market for handheld, portable electronics, package on package (PoP) continues to gain in popularity and seems likely to be implemented in other types of electronic assemblies.

In order to define internal assembly processes for PoP devices, an assembly and reliability study was undertaken. The first goal of this study was to assess the performance of different dippable fluxes and solder pastes in terms of assembly yield and quality, and the second goal was to assess the reliability of different variations of the test vehicle under accelerated thermal cycling. Thermal cycling was selected as the test method in this case to help define appropriate assembly processes for PoP devices used in higher reliability assemblies, where performance under thermal cycling would be a significant consideration. 

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