Regional Sites

Brazil
China
India
Japan
Korea
Mexico

Industry Blogs

Top blogs

Efficient line changeover: the key to lean manufacturing PDF Print E-mail
User Rating: / 1
PoorBest 
 

Posted by hglackey on 06 April 2009 at 10:20

Changes in the domestic printed circuit board assembly industry have resulted in a dominant shift to a high-mix, low-volume (HMLV) manufacturing environment resulting in a high frequency of line changeovers. Reducing changeover duration and optimizing the changeover process are critical ingredients to an efficient and profitable domestic HMLV operation. For extreme HMLV applications such as new product introduction (NPI), prototyping or short run manufacturing, changeover efficiency is an absolute necessity.



Implementing lean manufacturing practices is essential to reducing the accumulation of work-in-process inventories that are prevalent with a HMLV manufacturing environment. Putting into practice a single-minute exchange of die (SMED) philosophy is a vital component toward reducing non-value added changeover time since it has significant impact on the implementation of lean manufacturing practices.

This paper addresses the root cause of non-revenue generating line stoppages, such as feeder setup, substrate support setup, programming, tooling changeover, equipment maintenance and breakdown, and process corrections. A case study will be presented that analyzes the economic impact of line changeover in terms of hourly revenue per SMT line, burden cost per hour and line optimization rates. The proper selection of tools and procedures to reduce the setup process time for screen printers, pick and place machines and dispensing equipment is necessary to insure minimal changeover durations and increased line uptime. 

Read the full article in the digital edition of the magazine.

   
Quote this article in website
Favoured
Send to friend
Related articles
Save this to del.icio.us

Users' Comments  RSS feed comment
 

Average user rating

   (0 vote)

 


Add your comment
Name
E-mail
Title  
Comment
   Notify me of follow-up comments
   
   

No comment posted



mXcomment 1.0.9 © 2007-2010 - visualclinic.fr
License Creative Commons - Some rights reserved

Related Items

No related items

Featured Interview

Interview - Terry Heilman, Sunstone Circuits
Trevor Galbraith spoke to president and CEO Terry Heilman about what makes Sunstone different from your average board shop.
 

Small Matters

IC Packaging Technology Retrospective – Part 4

The electronics industry’s mantra has for many years been "Smaller, Faster, Lighter, Better and Cheaper."

 

Lead-Free Matters

Measuring package on package-possible procedure, comments welcome

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.

 

Global Business

Year end assessment: the path to recovery
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010.
 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff