| Posted by Jade Po Kellard on 15 April 2009 at 06:00
|
This event will run prior to SEMICON West 2009 - July 14-16.
Early Registration Deadline: June 19, 2009
Housing Deadline: June 29, 2009
Wire Bonding Workshop Focus:
The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.
Monday, July 13, 2009
Session 1: Copper and Gold Ball Bonding
Session Chairs: Daniel D. Evans, Jr., Palomar Technologies, Inc.; Joe Bubel, Hesse & Knipps
9:30 AM - 12:15 PM
Session 2: Wire / Ribbon Bonding & Materials
Session Chairs: Keith Easton, Oerlikon ESEC USA Inc.; Mike McKeown, Orthodyne Electronics Corporation
9:30 AM - 12:15 PM
LUNCH: 12:15 pm - 1:15 pm
Session 3: Copper and Gold Bonding & Materials
Session Chairs: Lee Levine, Process Solutions Consulting; Keith Easton, Oerlikon ESEC USA Inc.
1:15 PM - 4:15 PM
Register on-line at: www.imaps.org/wirebonding
Housing:Hotel Cut-off is June 29, 2009
The IMAPS Topical Workshop is being run at the San Francisco Marriott Hotel, in conjunction with SEMICON West.
To book online, Please visit the official housing site: https://www.cmrhousing.com/SEMI_S5/HotelList.aspx
Or call the SEMICON West Housing Office
Monday - Friday, 6:00am - 6:00pm Pacific Standard Time
1.800.421.2499 (US & Canada)
1.415.979.2287 (International)
Room Rate: Single: $273/night - 1 person
Double: $293/night - 2 persons
Please reference SEMICON West when making reservations by phone.
San Francisco Marriott Hotel
55 Fourth Street
San Francisco, CA 94103
Speaker Dates/Information:
Extended Abstract or Presentation Material due: June 12, 2009
Early Registration Deadline: June 19, 2009
Hotel Deadline: June 29, 2009
Powerpoint/Presentation file for CD-Rom due not later than: July 13, 2009
Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) |
Global SMT RSS feed
(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 